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20260925-0931-air-hub-industrial-linux-and-radio Evaluate industrial-grade Linux SoCs and radio chips for Air Hub

  • status: completed
  • createdAt: 2026-09-25 09:31
  • approvedAt: 2026-09-25 09:37
  • relatedTask: 20260925-0931-air-hub-industrial-linux-and-radio

Context

章节标题：“Context”

Current Air Hub package (bizplan/product/switch/air-hub/):

  • Spec P05-air-hub.md R0.4 §2: single model, "Linux (ARMv7, reference SSD202D) + 2×ESP32-C6", CAN through one C6's TWAI (B1); environment −20…+60 °C and a recorded gap against the family rule −25…+70 °C (SSD202D is −20…+85 °C).
  • Design P05-air-hub-design.md R0.1 §2.1 compares A (STM32G0 + nRF54L15), B (SSD202D + 2×C6, platform direction), C (single BLE MCU + SPI CAN); §2.3 lists sub-GHz / LoRa co-processor candidates; §2.5 recommends SSD202D, 2×C6, TJA1463, LMR36506-Q1 + TLV755P.
  • Precedent for non-binding device work: bizplan/product/switch/air/evaluations/ (kind evaluation, listed in the package index, cited only from open items).

New owner inputs (2026-09-25 conversation): one Linux SoC + one radio chip; industrial-grade silicon required; two single-radio variants — V1 Linux + 2.4 GHz (BLE / Zigbee / Thread, function selected by radio firmware image), V2 Linux + sub-GHz (LoRa, 433 MHz); add RK3506J as the alternative platform; collect radio candidates.

Findings (sources: vendor datasheets, LCSC listings via jlcsearch, retrieved 2026-09-25):

  • Industrial Linux SoCs with native CAN: Rockchip RK3506J (3×A7 1.5 GHz + M0, 2×CAN-FD, 2×RMII, external DDR2/3/3L, FBGA333, −40…+85 °C, LCSC from $4.12) and Allwinner T113-i (2×A7 + C906 + HiFi4, 2×CAN 2.0A/B, 1×GbE EMAC, external DDR2/3, LFBGA337, −40…+85 °C, LCSC $6.24 @119). In-package-DDR parts are not industrial: T113-S3 −25…+75, RK3506G2 −20…+80, SSD202D −20…+85. SigmaStar has no native-CAN industrial part found (SSD268G is −40…+85 but a vision SoC; SSD2351 is −20…+70). RK3562J/3568J/3576J and T536/T507-H are oversized for this role.
  • External DDR3L dominates the BOM: LCSC 2 Gb DDR3L x16 is $7.3 @1k commercial (Winbond W632GU6RB-09), $10–14 industrial (MT41K128M16JT IT, IS43TR16128DL-BLI); 4 Gb industrial $20–27. RK3506J + 256 MB industrial DDR3L ≈ $14–18, i.e. more than the SoC. A module (Forlinx FET3506J-C, 40×29 mm, 88 CNY list) is cost-competitive at low volume.
  • V1 radio candidates (LCSC @1k unless noted): EFR32MG21 $3.41, CC2652P7 $3.26, nRF52840 $3.73, ESP32-C6-MINI-1-N4 module $2.85, EFR32MG24 $8.7–12.4 small-stock listing, CC2674P10 $11.2 @100; modules RF-BM-2652P4 $5.65, E72-2G4M20S1C $7.43.
  • V1 radio candidates added on request: nRF54L15 (not listed on LCSC; +8 dBm max; OpenThread RCP is an official NCS co-processor sample; Zigbee R23 only as an experimental NCS add-on and the zigbee2mqtt ZBOSS adapter is experimental without coordinator backup; same vendor as the Air first-version platform), CC2755R10 ($5.34 @100, LCSC stock 10; BLE 6.0, Thread / Matter; Zigbee via ZBOSS, same host-side gap as Nordic; Air alternative platform), CC2652R7 / P7 ($3.12 / $3.26 @1k; Z-Stack is the most deployed zigbee2mqtt coordinator firmware; Thread exists but TI's Thread / Matter focus moved to CC2674 / CC27xx), CC2674R10 / P10 ($11.2 @100 for P10, module E72-2G4M20S1C $7.43; Z-Stack supported in zigbee2mqtt, Thread / Matter, secure boot and debug lock).
  • V2 radio candidates: LLCC68 $1.10, SX1262 $1.75, SX1278 $2.59, SX1276 $3.06, LR1121 $2.78, STM32WLE5CC $2.65–5.21, CC1312R $2.43, CMT2300A $0.87, CC1101 $0.97, Si4463 $1.12. OOK (third-party 433 remotes) is supported by SX1276/78, CC1312R, CMT2300A, CC1101, Si4463; not by SX1262, LLCC68, LR1121, STM32WL.

Proposal

章节标题：“Proposal”
  1. New page bizplan/product/switch/air-hub/evaluations/industrial-linux-and-radio.md (kind evaluation, Chinese): scope and assumptions (two variants are an evaluation premise, not a spec decision); industrial SoC table for Allwinner / Rockchip / SigmaStar; DDR3L cost finding and the chip-down vs. module choice; V1 radio table with host-stack maturity (zigbee2mqtt / ZHA, OTBR RCP, BlueZ HCI) and firmware-image switching; V2 radio table with LoRa / FSK / OOK support and band notes; BOM per variant; recommendations mapped to AIR-O-03 and AIR-O-09.
  2. bizplan/product/switch/air-hub/index.md: add the evaluations table with one row.
  3. P05-air-hub-design.md §2.5 main-controller row: add "alternative: RK3506J (industrial, 2×CAN-FD, external DDR3L)" with a link to the evaluation; bump to R0.2 with a change-log row.
  4. docs/changelog.md entry; task and plan closed.

Risks

章节标题：“Risks”
  • LCSC retail is not volume pricing; DDR3 prices are volatile (2025–26 DDR3 EOL cycle). The page labels every price with source, quantity tier and date.
  • Adding RK3506J to the design without changing the spec's "reference SSD202D" leaves the spec's platform row and temperature gap as they are; industrial grade and the two-variant split are Level 1 changes that need their own task.

Scope

章节标题：“Scope”

In: files in Proposal 1–4. Out: spec P05-air-hub.md, guide, brief, Air package, P09.

Alternatives

章节标题：“Alternatives”
  • Evaluation page only, no design-appendix edit (strictly non-binding).
  • Also change spec §2 (platform row, industrial temperature, two variants) in this task.